Submit abstracts today: Deadline : 20 June, 2017
16th International Symposium on Microelectronics and Packaging (ISMP2017) is organized by KMEPS (The Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in Materials, Processing, Simulation, Printed Electronics, Nano/Micro Joining Technology and Reliability of Electronic Packaging. We cordially invite you to submit abstracts for the conference, and look forward to welcoming you in COEX, Seoul, Korea
General Chair of ISMP2017 Yong Chul Park |
| Dear Colleague,
Please submit abstract today for ISMP 2017 - the 16th International Symposium on Microelectronics and Packaging, 17-19 October 2017 in COEX, Seoul, Korea
Abstracts for oral and poster presentations will be accepted until June 20, 2017.
Submit oral and poster presentation abstracts here.
Symposium Topics - Electronic Materials and Processing
- Optoelectronic and Photonic Materials and Processing
- Advanced Packaging Technologies
- 3D Integration and Packaging
- LED Packaging and Applications
- MEMS Packaging and Applications
- Modeling, Simulation, Quality and Reliability of Electronic Components
- Nanomaterials and its Application Technology
- Micro/Nano Joining Technology
- Interconnection Materials and its Reliability
- IoT (Internet of Things), Sensor Devices and System
- Soldering and Surface Mount Technology
- Wearable and Stretchable Electronics
- Printed Electronics and Materials
| | International Semiconductor Exhibition October 17-19 COEX For detail information click here (www.coex.co.kr) |
| | Important Dates | June 20, 2017
Abstract submission deadline | July 1, 2017
Notification of Acceptance | September 17, 2017
Pre-registration | October 31, 2017
Submission of Final Manuscript |
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