Submit abstracts today : Deadline : 30 June, 2016
"The due date of ISMP2016 abstract submission" is extended to June 30, 2016!!
15th International Symposium on Microelectronics and Packaging (ISMP 2016) is organized by KMEPS (The Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in Materials, Processing, Simulation, Printed Electronics, Nano/Micro Joining Technology and Reliability of Electronic Packaging. We cordially invite you to submit abstracts for the conference, and look forward to welcoming you in COEX, Seoul, Korea
General Chairman of ISMP 2016 Ho Jung Chang, Ph.D |
| Dear Colleague,
Please submit abstract today for ISMP 2016 - the 15th International Symposium on Microelectronics and Packaging, 24-26 October 2016 in COEX, Seoul, Korea
Abstracts for oral and poster presentations will be accepted until June 30, 2016.
Submit oral and poster presentation abstracts here.
Symposium Topics - Electronic Materials and Processing
- Optoelectronic and Photonic Materials and Processing
- Advanced Packaging Technologies
- 3D Integration and Packaging
- LED Packaging and Applications
- MEMS Packaging and Applications
- Modeling, Simulation, Quality and Reliability of Electronic Components
- Nanomaterials and its Application Technology
- Micro/Nano Joining Technology
- Interconnection Materials and its Reliability
- IoT (Internet of Things), Sensor Devices and System
- Soldering and Surface Mount Technology
- Wearable and Stretchable Electronics
- Printed Electronics and Materials
| | International Semiconductor Exhibition October 24-26 COEX For detail information click here (www.coex.co.kr) |
| | Important Dates | June 30, 2016
Abstract submission deadline | July 15, 2016
Notification of Acceptance | September 23, 2016
Pre-registration | October 31, 2016
Submission of Final Manuscript |
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