| Dear Colleague,
Please submit abstract today for ISMP 2015 - the 14th International Symposium on Microelectronics and Packaging, 13-15 October 2015 in KINTEX Hall2, Seoul / llsan, Korea
Abstracts for oral and poster presentations will be accepted until 31 July, 2015.
Submit oral and poster presentation abstracts here.
Symposium Topics
- Electronic Materials and Processing
- Optoelectronic and Photonic Materials and Processing
- Advanced Packaging Technologies
- 3D Integration and Packaging
- LED Packaging and Applications
- MEMS Packaging and Applications
- Modeling, Simulation, Quality and Reliability of Electronic Components
- Nanomaterials and its Application Technology
- Micro/Nano Joining Technology
- Interconnection Materials and its Reliability
- IoT (Internet of Things), Sensor Devices and System
- Soldering and Surface Mount Technology
- Wearable and Stretchable Electronics
- Printed Electronics and Materials
| | i-SEDEX 2015 International Semiconductor Exhibition October 14-16 KINTEX KOREA For detail information click here (www.isedex.com) |
| | Important Dates | July 31, 2015
Abstract submission deadline | August 15, 2015
Notification of Acceptance | August 31, 2015
Pre-registration | October 15, 2015
Submission of Final Manuscript |
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