 | | Submit abstracts today : Deadline : 31 May 2015 2015 14th International Symposium on Microelectronics and Packaging (ISMP 2015) is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in Materials, Processing, Simulation, Printed Electronics, Nano/Micro Joining Technology and Reliability of Electronic Packaging. We cordially invite you to submit abstracts for the conference, and look forward to welcoming you in KINTEX Hall2, Seoul / llsan, Korea General Chairman of ISMP 2015 Ho Jung Chang, Ph.D | | Dear Colleague,
Symposium Topics - Electronic Materials and Processing
- Optoelectronic and Photonic Materials and Processing
- Advanced Packaging Technologies
- 3D Integration and Packaging
- LED Packaging and Applications
- MEMS Packaging and Applications
- Modeling, Simulation, Quality and Reliability of Electronic Components
- Nanomaterials and its Application Technology
- Micro/Nano Joining Technology
- Interconnection Materials and its Reliability
- IoT (Internet of Things), Sensor Devices and System
- Soldering and Surface Mount Technology
- Wearable and Stretchable Electronics
- Printed Electronics and Materials
| | i-SEDEX 2015 International Semiconductor Exhibition October 14-16 KINTEX KOREA For detail information click here (www.isedex.com) |
| | Important Dates | May 31, 2015
Abstract submission deadline | July 15, 2015
Notification of Acceptance | August 15, 2015
Pre-registration | August 15, 2015
Submission of Final Manuscript |
|
|
|
