(14th International Symposium on Microelectronics and Packaging)
October 13(Tue)-15(Thu), 2015 KINTEX Hall2, Seoul / llsan, Korea
INVITATION It is our pleasure to announce that the 14th International Symposium on Microelectronics and Packaging (ISMP 2015) will be held at KINTEX (Korea International Exhibition Center) convention center located at Seoul/Ilsan Korea during October 13-15 2015. This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in Materials, Processing, Simulation, Printed Electronics, Nano/Micro Joining Technology and Reliability of Electronic Packaging. The technical sessions for oral and poster presentations will be in parallel with the 17th International Semiconductor Exhibition (http://www.sedex.org) at KINTEX. The ISMP 2015 will provide an excellent opportunity for scientists and engineers of academic institutes and industries to discuss recent advances in electronic packaging technology and forecast new technological directions. We cordially invite you to submit abstracts for the conference, and look forward to welcoming you in Seoul, Korea.
General Chairman of ISMP 2015, Ho Jung Chang, Ph.D
ISMP2015 1st Call for Paper <= Click!! Download!!