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학회소식

The Korean Microelectronic and Packaging Society

학회 주요일정

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제목 2021년 11월 3일(수)-5일(금) - ISMP 2021 (Hanwha Resort, Busan, Korea)
작성자 관리자1 등록일 2021-06-18
이메일 kmeps@kmeps.or.kr

ISMP 2021 

The 19th International Symposium on Microelectronics and Packaging
Special Symposium to Honor Retirement of Professor Kyung W. Paik​
 
November 3(Wed.)-5(Fri.), 2021, Hanwha Resort, Busan, Korea
Hybrid (both onsite face-to-face and online sessions) Symposium
 
INVITATION
It is our great pleasure to announce that the 19th International Symposium on Microelectronics and Packaging (ISMP cor2021) will be held as hybrid meeting (both onsite face-to-face and online sessions) at Haeundae Hanwha Resort, Busan, Korea, on November 3(Wed.)-5(Fri.), 2021. The ISMP 2021, organized by KMEPS (the Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world. The ISMP 2021 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. Also, ISMP 2021 inaugurates special symposium in memory and in recognition of the scientific contributions of Professor Kyung W. Paik. We cordially invites you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2021 in November.
 
SYMPOSIUM TOPICS
ISMP 2021 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:
 
  1. Novel Packaging Technologies for AI, IoT, and Big data
  2. Packaging Solutions for 5G/6G Applications
  3. System Integration with Advanced Packaging Technologies
  4. Electrinoc Materials for Interconnects and Packaging
  5. Emerging Process for Interconnects and Packaging
  6. PCB, Solder, and Assembly Process
  7. Automotive and Power Electronic Packaging
  8. Sensors, LED, and Emerging Packaging Technology
  9. Flexible, Wearable, and Printed Electronics
  10. MEMS/NEMS Packaging and Applications
  11. Reliability of Electronic Devices and Systems
  12. Design Tools and Modeling
IMPORTANT DATES
Submission of Abstract
August 31, 2021
Notification of Acceptance
September 21, 2021
Pre-registration
October 25, 2021
Symposium
November 3-5, 2021
Submission of Final Manuscript          
December 31, 2021
 
CONFERENCE LANGUAGE
The official language of the symposium is English.
 
SYMPOSIUM SECRETARIAT (CONTACT)
Ms. Min-Jin Kim (KMEPS)
Tel: +82-2-538-0962, Fax: +82-2-538-0963
 
Visit the ISMP 2021 website (http://ismp2021.org/) for additional symposium information.
 
Organized by The Korean Microelectronics and Packaging Society (KMEPS)