The Korean Microelectronic and Packaging Society

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제목 2021년 11월 10일(수)-12일(금) - ISMP 2021 (Busan, Korea)
작성자 관리자1 등록일 2021-05-20
이메일 kmeps@kmeps.or.kr

ISMP 2021 

The 19th International Symposium on Microelectronics and Packaging
November 10(Wed.)-12(Fri.), 2021, Busan, Korea
Hybrid (both onsite face-to-face and online sessions) Symposium
It is our great pleasure to announce that the 19th International Symposium on Microelectronics and Packaging (ISMP cor2021) will be held as hybrid meeting (both onsite face-to-face and online sessions) at Busan, Korea, on November 10(Wed.)-12(Fri.), 2021. The ISMP 2021, organized by KMEPS (the Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world. The ISMP 2021 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invites you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2021 in November.
ISMP 2021 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:
  1. Novel Packaging Technologies for AI, IoT, and Big data
  2. Packaging Solutions for 5G/6G Applications
  3. System Integration with Advanced Packaging Technologies
  4. Electrinoc Materials for Interconnects and Packaging
  5. Emerging Process for Interconnects and Packaging
  6. PCB, Solder, and Assembly Process
  7. Automotive and Power Electronic Packaging
  8. Sensors, LED, and Emerging Packaging Technology
  9. Flexible, Wearable, and Printed Electronics
  10. MEMS/NEMS Packaging and Applications
  11. Reliability of Electronic Devices and Systems
  12. Design Tools and Modeling
Submission of Abstract
July 30, 2021
Notification of Acceptance
August 31, 2021
October 31, 2021
November 10-12, 2021
Submission of Final Manuscript
December 31, 2021
The official language of the symposium is English.
Ms. Min-Jin Kim (KMEPS)
Tel: +82-2-538-0962, Fax: +82-2-538-0963
Visit the ISMP 2021 website (http://ismp2021.org/) for additional symposium information.
Organized by The Korean Microelectronics and Packaging Society (KMEPS)