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학회소식

The Korean Microelectronic and Packaging Society

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제목 Information for ISMP2021
작성자 관리자1 등록일 2020-11-10
이메일 kmeps@kmeps.or.kr
ISMP2021
The 19th International Symposium on Microelectronics and Packaging
November, 2021, Busan, Korea


 
SYMPOSIUM TOPICS
ISMP2021 will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging.
Topics may include from, but are not limited to, the following areas
- Advanced Packaging Technologies
- Electronic Materials for Interconnects and Packaging
- Emerging Process for Interconnects and Packaging
- PCB, Solder, and Assembly Process
- Power Electronic Packaging
- Sensors, LED, and Emerging Packaging Technology
- Wearable and Printed Electronics
- MEMS/NEMS Packaging and Applications
- Reliability of Electronic Devices and Systems
- Design Tools and Modeling


IMPORTANT DATES
Submission of Abstract July 15, 2020

CONFERENCE LANGUAGE
The official language of the symposium is English.

All schedules may vary depending on the situation.
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