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The Korean Microelectronic and Packaging Society

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[°øÁö] [MOU] Â÷¼¼´ëÁö´ÉÇü¹ÝµµÃ¼»ç¾÷´Ü(NIS)°ú »óÈ£Çù·ÂÇù¾à½Ä(MOU) ü°á °ü¸®ÀÚ1 2022-05-27 164
[°øÁö] [KMEPS] ÀÓ¿ø ¿öÅ©¼¥ ¼º·á °ü¸®ÀÚ1 2022-05-23 203
[°øÁö] [ISMP 2022] Á¦20ȸ ±¹Á¦Çмú´ëȸ °³ÃÖ (ºÎ»ê ÇØ¿î´ë ÇÑÈ­¸®Á¶Æ®) °ü¸®ÀÚ1 2022-05-19 212
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[°øÁö] [KMEPS] ⸳ 30Áֳ⠱â³ä ¹× 2022³â Á¤±âÇмú´ëȸ ¼º·á °ü¸®ÀÚ1 2022-04-30 271
[°øÁö] KMEPS 2021³â ÇÐᆞ¿¬Àü¹®°¡ ¿¬±¸¼Ò°³Áý ¹ß°£ °ü¸®ÀÚ1 2021-10-08 1309
[°øÁö] Ú¸ Gallup °­Á¡ ±â¹Ý °³¹ß°ú ÄÚĪ ÇÁ·Î±×·¥ ¿î¿µ ¹× ½Åû ¾È³» °ü¸®ÀÚ1 2021-03-24 1645
97 2020³â Ãá°èÇмú´ëȸ Á¦¸ñ,ÃÊ·ÏÁ¢¼ö ¾È³» °ü¸®ÀÚ1 2019-11-08 1194
96 MPC 2019 - Ãß°èÄÁÆÛ·±½º °ü¸®ÀÚ1 2019-08-23 1367
95 Tutorial 2019 °ü¸®ÀÚ1 2019-08-12 1142
94 1st CFP. ISMP-EMAP2019 Submission of Abstract July 15, 2019 °ü¸®ÀÚ1 2019-06-21 1091
93 [ºÎ°í] ´ë´öÀüÀÚ, KMEPS ¸í¿¹È¸Àå ±èÁ¤½Ä ȸÀå´Ô º°¼¼ °ü¸®ÀÚ1 2019-04-12 867
92 2019³â Ãá°èÇмú´ëȸ »çÀüµî·Ï ¾È³» °ü¸®ÀÚ1 2019-03-18 1420
91 2019³â Ãá°èÇмú´ëȸ Á¦¸ñ,ÃÊ·ÏÁ¢¼ö ¾È³» °ü¸®ÀÚ1 2019-01-28 1453
90 12¿ù 19ÀÏ ÇÐȸ °³¼Ò½Ä ¹× ÇÐȸ»ó ½Ã»ó½Ä, ¼Û³âȸ °ü¸®ÀÚ1 2018-12-26 1138
89 ¹Ì·¡ ÀüÀÚ ¼ÒÀÚ ¹× ÆÐŰÁö¿ë ¹è¼± ±â¼ú °ü¸®ÀÚ1 2018-12-13 1450
88 Call for Paper. ISMP2018 abstract submission deadline is extended. °ü¸®ÀÚ1 2018-07-19 1289
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