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The Korean Microelectronic and Packaging Society

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[°øÁö] [MOU] Â÷¼¼´ëÁö´ÉÇü¹ÝµµÃ¼»ç¾÷´Ü(NIS)°ú »óÈ£Çù·ÂÇù¾à½Ä(MOU) ü°á °ü¸®ÀÚ1 2022-05-27 164
[°øÁö] [KMEPS] ÀÓ¿ø ¿öÅ©¼¥ ¼º·á °ü¸®ÀÚ1 2022-05-23 204
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[°øÁö] KMEPS 2021³â ÇÐᆞ¿¬Àü¹®°¡ ¿¬±¸¼Ò°³Áý ¹ß°£ °ü¸®ÀÚ1 2021-10-08 1309
[°øÁö] Ú¸ Gallup °­Á¡ ±â¹Ý °³¹ß°ú ÄÚĪ ÇÁ·Î±×·¥ ¿î¿µ ¹× ½Åû ¾È³» °ü¸®ÀÚ1 2021-03-24 1645
127 [ISMP2021] ±¹Á¦Çмú´ëȸ ¼º·á °ü¸®ÀÚ1 2021-11-12 1044
126 [KMEPS] 2021³â ÇØµ¿ÀþÀº°øÇÐÀλó ¼ö»óÀÚ ¹ßÇ¥ ¹× ½Ã»ó ¾È³» (12¿ù 9ÀÏ(¸ñ) 5½Ã) °ü¸®ÀÚ1 2021-11-12 327
125 [ISMP2021] ȸ¿ø»ç ºÎ½º(ä¿ë ´ë¸é »ó´ã µî) ¿î¿µ ¿¹Á¤ °ü¸®ÀÚ1 2021-10-12 422
124 KMEPS 2021³â ÇÐᆞ¿¬Àü¹®°¡ ¿¬±¸¼Ò°³Áý ¹ß°£ °ü¸®ÀÚ1 2021-10-08 1309
123 [Æ÷·³] ¹ÝµµÃ¼ ÆÐŰ¡ »ê¾÷ Forum °³ÃÖ (2021/10/7(¸ñ) ¿ÀÈÄ 2½Ã~) °ü¸®ÀÚ1 2021-09-29 615
122 (¿¬Àå) [KMEPS] 2021³âµµ ÇØµ¿ÀþÀº°øÇÐÀλó Ãßõ ¸ðÁý °ø°í (~10/17(ÀÏ), ÀÚÁ¤±îÁö) °ü¸®ÀÚ1 2021-08-31 627
121 [Â÷¼¼´ëÀ¶ÇÕ±â¼ú¿ø ¼ÒºÎÀå »ç¾÷´Ü] Á߾Ӻм®Áö¿ø½Ç ¹× ¼ÒÀçºÎǰ ¿ÀÇ·¦ ¾È³» °ü¸®ÀÚ1 2021-08-26 225
120 [4´Ü°è BK21 »ç¾÷] ±¹Á¦Çмú´ëȸ ÀÎÁ¤±âÁØ ¾È³» °ü¸®ÀÚ1 2021-08-25 250
119 [Æ÷·³] Á¦3ȸ °æ±âµµ ¼ÒÀ硤ºÎǰ¡¤Àåºñ»ê¾÷ »ó»ýÆ÷·³ ¡®¹ÝµµÃ¼ ¼Ò¡¤ºÎ¡¤Àå ºÐ¾ßÀÇ ¹Ì·¡¡¯ °³ÃÖ °ü¸®ÀÚ1 2021-06-16 840
118 ISMP 2021 (The 19th International Symposium on Microelectronics and Packaging) °³ÃÖ °ü¸®ÀÚ1 2021-05-26 1064
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