ÇÐȸ¼Ò°³
ȸÀåÀλ縻
ÇÐȸ¼Ò°³
ÀÓ¿ø¼Ò°³
¸í¿¹È¸Àå
¿¬Çõ
Á¤°ü
Á¶Á÷µµ
ÇÐȸ»ç¹«±¹
ȸ¿ø¾È³»
°¡ÀԾȳ»
´Üüȸ¿ø¼Ò°³
ȸ¿ø°Ë»ö
ÇÐȸÁö/°£Ç๰
Çѱ¹¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ ÇÐȸÁö
´º½º·¹ÅÍ
ÇÐȸ¹ß°£µµ¼
ÇÐȸÁö/³í¹®Áö ¿¶÷
Lecture
Lecture
°ÀÇÀÚ·á½Ç
ÇмúÇà»ç
±¹³»Çмú´ëȸ
±¹Á¦Çмú´ëȸ
Àδõ½ºÆ®¸® Æ÷·³
Æ©Å͸®¾ó ÄÚ½º
ÇÐȸ¼Ò½Ä
°øÁö»çÇ×
ȸ¿ø ¹× ȸ¿ø»ç µ¿Á¤
ÆÐŰ¡ ¼Ò½Ä
ÇÐȸ ÁÖ¿äÀÏÁ¤
ȸ¿ø°Ô½ÃÆÇ
ÇÐȸ¼Ò½Ä
The Korean Microelectronic and Packaging Society
°øÁö»çÇ×
> ÇÐȸ¼Ò½Ä >
°øÁö»çÇ×
¹øÈ£
Á¦¸ñ
ÀÛ¼ºÀÚ
µî·ÏÀÏ
Á¶È¸¼ö
[°øÁö]
[Àú³ÎÅõ°í] ¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸÁö Åõ°í ¾È³»
°ü¸®ÀÚ1
2022-06-09
113
[°øÁö]
[MOU] Â÷¼¼´ëÁö´ÉÇü¹ÝµµÃ¼»ç¾÷´Ü(NIS)°ú »óÈ£Çù·ÂÇù¾à½Ä(MOU) ü°á
°ü¸®ÀÚ1
2022-05-27
164
[°øÁö]
[KMEPS] ÀÓ¿ø ¿öÅ©¼¥ ¼º·á
°ü¸®ÀÚ1
2022-05-23
204
[°øÁö]
[ISMP 2022] Á¦20ȸ ±¹Á¦Çмú´ëȸ °³ÃÖ (ºÎ»ê ÇØ¿î´ë ÇÑȸ®Á¶Æ®)
°ü¸®ÀÚ1
2022-05-19
212
[°øÁö]
[KMEPS] ÇÐȸÁö È£º° ¿ì¼ö ³í¹®»ó ½Å¼³ ¹× ¼ö»óÀÚ ½Ã»ó
°ü¸®ÀÚ1
2022-04-30
256
[°øÁö]
[KMEPS] ⸳ 30Áֳ⠱â³ä ¹× 2022³â Á¤±âÇмú´ëȸ ¼º·á
°ü¸®ÀÚ1
2022-04-30
271
[°øÁö]
KMEPS 2021³â ÇÐᆞ¿¬Àü¹®°¡ ¿¬±¸¼Ò°³Áý ¹ß°£
°ü¸®ÀÚ1
2021-10-08
1309
[°øÁö]
Ú¸ Gallup °Á¡ ±â¹Ý °³¹ß°ú ÄÚĪ ÇÁ·Î±×·¥ ¿î¿µ ¹× ½Åû ¾È³»
°ü¸®ÀÚ1
2021-03-24
1645
127
[ISMP2021] ±¹Á¦Çмú´ëȸ ¼º·á
°ü¸®ÀÚ1
2021-11-12
1044
126
[KMEPS] 2021³â ÇØµ¿ÀþÀº°øÇÐÀλó ¼ö»óÀÚ ¹ßÇ¥ ¹× ½Ã»ó ¾È³» (12¿ù 9ÀÏ(¸ñ) 5½Ã)
°ü¸®ÀÚ1
2021-11-12
327
125
[ISMP2021] ȸ¿ø»ç ºÎ½º(ä¿ë ´ë¸é »ó´ã µî) ¿î¿µ ¿¹Á¤
°ü¸®ÀÚ1
2021-10-12
422
124
KMEPS 2021³â ÇÐᆞ¿¬Àü¹®°¡ ¿¬±¸¼Ò°³Áý ¹ß°£
°ü¸®ÀÚ1
2021-10-08
1309
123
[Æ÷·³] ¹ÝµµÃ¼ ÆÐŰ¡ »ê¾÷ Forum °³ÃÖ (2021/10/7(¸ñ) ¿ÀÈÄ 2½Ã~)
°ü¸®ÀÚ1
2021-09-29
615
122
(¿¬Àå) [KMEPS] 2021³âµµ ÇØµ¿ÀþÀº°øÇÐÀλó Ãßõ ¸ðÁý °ø°í (~10/17(ÀÏ), ÀÚÁ¤±îÁö)
°ü¸®ÀÚ1
2021-08-31
627
121
[Â÷¼¼´ëÀ¶ÇÕ±â¼ú¿ø ¼ÒºÎÀå »ç¾÷´Ü] Á߾Ӻм®Áö¿ø½Ç ¹× ¼ÒÀçºÎǰ ¿ÀÇ·¦ ¾È³»
°ü¸®ÀÚ1
2021-08-26
225
120
[4´Ü°è BK21 »ç¾÷] ±¹Á¦Çмú´ëȸ ÀÎÁ¤±âÁØ ¾È³»
°ü¸®ÀÚ1
2021-08-25
250
119
[Æ÷·³] Á¦3ȸ °æ±âµµ ¼ÒÀ硤ºÎǰ¡¤Àåºñ»ê¾÷ »ó»ýÆ÷·³ ¡®¹ÝµµÃ¼ ¼Ò¡¤ºÎ¡¤Àå ºÐ¾ßÀÇ ¹Ì·¡¡¯ °³ÃÖ
°ü¸®ÀÚ1
2021-06-16
840
118
ISMP 2021 (The 19th International Symposium on Microelectronics and Packaging) °³ÃÖ
°ü¸®ÀÚ1
2021-05-26
1064
1
2
3
4
5
6
7
8
9
10
Á¦¸ñ
³»¿ë
ÀÛ¼ºÀÚ
ÃÖ±Ù 1°³¿ù
ÃÖ±Ù 3°³¿ù
Àüü