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The Korean Microelectronic and Packaging Society

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[°øÁö] [MOU] Â÷¼¼´ëÁö´ÉÇü¹ÝµµÃ¼»ç¾÷´Ü(NIS)°ú »óÈ£Çù·ÂÇù¾à½Ä(MOU) ü°á °ü¸®ÀÚ1 2022-05-27 164
[°øÁö] [KMEPS] ÀÓ¿ø ¿öÅ©¼¥ ¼º·á °ü¸®ÀÚ1 2022-05-23 204
[°øÁö] [ISMP 2022] Á¦20ȸ ±¹Á¦Çмú´ëȸ °³ÃÖ (ºÎ»ê ÇØ¿î´ë ÇÑÈ­¸®Á¶Æ®) °ü¸®ÀÚ1 2022-05-19 213
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[°øÁö] [KMEPS] ⸳ 30Áֳ⠱â³ä ¹× 2022³â Á¤±âÇмú´ëȸ ¼º·á °ü¸®ÀÚ1 2022-04-30 271
[°øÁö] KMEPS 2021³â ÇÐᆞ¿¬Àü¹®°¡ ¿¬±¸¼Ò°³Áý ¹ß°£ °ü¸®ÀÚ1 2021-10-08 1309
[°øÁö] Ú¸ Gallup °­Á¡ ±â¹Ý °³¹ß°ú ÄÚĪ ÇÁ·Î±×·¥ ¿î¿µ ¹× ½Åû ¾È³» °ü¸®ÀÚ1 2021-03-24 1645
47 ISMP 2014 ¹ßÇ¥ÀÚ·á (10/15) °ü¸®ÀÚ1 2015-01-16 1455
46 2015Çг⵵ 1Çб⠰æ±â´ëÇб³ SDM Àü°ø ¼®»ç°úÁ¤ ½ÅÀÔ»ý Ãß°¡¸ðÁý ¾È³» °ü¸®ÀÚ1 2014-12-09 1477
45 2014³âµµ ÇØµ¿»ó ¼ö»óÀÚ °ü¸®ÀÚ1 2014-11-18 1706
44 ISMP-IAAC 2014 °³ÃÖ Èı⠰ü¸®ÀÚ1 2014-11-18 1657
43 2014³â Á¤±âÇмú´ëȸ ¾È³» °ü¸®ÀÚ1 2014-11-05 1955
42 ISMP-IAAC 2014 °ü¸®ÀÚ1 2014-09-11 2350
41 2014 ALC Meeting °ü¸®ÀÚ1 2014-04-30 2044
40 SMT/PCB NEPCON KOREA 2014 °ü¸®ÀÚ1 2014-03-13 1931
39 2013 Á¤±âÇмú´ëȸ ¾È³» °ü¸®ÀÚ1 2013-11-05 2432
38 ETRI °è¾àÁ÷ ¿¬±¸¿ø ä¿ë °ø°í °ü¸®ÀÚ1 2013-10-14 2302
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