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학술행사

The Korean Microelectronic and Packaging Society

관련행사

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2009 EMAP [상세내용보기]
일자 2009-12-01 ~ 2009-12-03
장소 Pennang, Malaysia
소개 EMAP 2009 is an international event organized by the School of Mechanical Engineering, Universiti Sains Malaysia, Penang, Malaysia. The objective of this conference is to establish an international forum of experts and researchers for the exchange, dissemination and discussion of state-of-the-art technologies and recent developments in electronic materials, packaging, manufacturing and assembly. As you are aware, the yearly EMAP conference was started in 1999 by an international forum of experts in the area of electronic materials and packaging and regularly co-sponsored by the CPMT society of IEEE. The conference venue will be at Gurney Hotel in Penang Island, one of the prestigious tourist places of Malaysia. The details of the conference is available at our website:

http://mechanical.eng.usm.my/EMAP2009